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[Rotary Polishing Achievements] Thin Material Polishing

Thin material polishing such as 0.8 to 0.7 millimeters is also possible! Introducing our achievements in rotary polishing.

We would like to introduce our achievements in thin material polishing using rotary grinding at KANO PRECISION Co., Ltd. The material is SK5, with a size of an outer diameter of 90 millimeters. Since a specific grinding pattern is required, we polished it from 0.8 millimeters to 0.7 millimeters using a special holding method. Additionally, we have examples of processing done to prevent warping, as even the slightest lift when placed on a flat surface can lead to defects. 【Polishing Achievements (Material: SK5)】 ■ Size: Outer diameter 90 millimeters ■ Plate thickness: Finished at t0.7 millimeters ■ Surface roughness: Ra0.2μ or less ■ Flatness: 0.05 or less *For more details, please download the PDF or feel free to contact us.

  • Grinding Machine
  • Processing Contract
  • Wafer processing/polishing equipment

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